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A successful realisation of sub-20 nm features on silicon (Si) is becoming the focus of many technological studies, strongly influencing the future performance of modern integrated circuits. Although reactive ion etching (RIE), at both micrometric and nanometric scale has already been the target of many studies, a better understanding of the different mechanisms involved at sub-20 nm size etching is still required. In this work, we investigated the influence of the feature size on the etch rate of Si, performed by a cryogenic RIE process through cylinder-forming polystyrene-block-polymethylmethacrylate (PS-b-PMMA) diblock copolymer (DBC) masks with diameter ranging between 19–13 nm. A sensible decrease of the etch depth and etch rate was observed in the mask with the smallest feature size. For all the DBCs under investigation, we determined the process window useful for the correct transfer of the nanometric …
IOP Publishing
Publication date: 
12 Sep 2017

M Dialameh, F Ferrarese Lupi, Dario Imbraguglio, F Zanenga, A Lamperti, D Martella, G Seguini, M Perego, Andrea Mario Rossi, N De Leo, L Boarino

Biblio References: 
Volume: 28 Issue: 40 Pages: 404001